Grants and Contributions:
Title:
3D packaging technologies for high capacity interconnect
Agreement Number:
911938
Agreement Value:
$2,000,000.00
Agreement Date:
Aug 1, 2018 - Feb 28, 2020
Description:
The current packaging technologies use a 2 dimensional approach where by the components are laid out on a 2 dimensional substrate and each component is connected to the adjacent component using traditional wirebonds and optical lenses. This approach worked well for low capacity components, however as the speeds go beyond 50Gb/s per lane, the capacities grow beyond 400Gb/s per module and the real-estate for such functionality shrinks, the packaging needs to move into 3D and the designs need to be matched to gain optimum yield and tolerance to process variations.
Organization:
National Research Council Canada
Expected Results:
The purpose of IRAP Contributions to Firms is to support research, development, adoption and/or adaptation of innovative or technology-driven new or improved products, services or processes in Canada up to their commercialization
Location:
Ottawa, Ontario, CA K2H 8R6
Reference Number:
172-2018-2019-Q2-911938
Agreement Type:
Contribution
Report Type:
Grants and Contributions
Recipient Business Number:
826931883
Recipient Type:
For-profit organization
Recipient's Legal Name:
Ranovus Inc.
Federal Riding Name:
Nepean
Federal Riding Number:
35064
Program:
Industrial Research Assistance Program – Contributions to Firms
Program Purpose:
The purpose of IRAP Contributions to Firms is to support research, development, adoption and/or adaptation of innovative or technology-driven new or improved products, services or processes in Canada up to their commercialization
Coverage:
IRAP Contributions to Firms projects stimulate wealth creation for Canada through technological innovation.
NAICS Code:
334290