Grants and Contributions:

Grant or Award spanning more than one fiscal year. (2017-2018 to 2018-2019)

The object of this research project is to initiate an assessment of Au stud bump flip chip attach of siliconx000D
photonic (SiP) chips for the packaging of photonics modules of interest to the industrial partner TeraXion.x000D
Employing its scientific and industrial knowledge and expertise in 'flip-chip' type bonding technology prevalentx000D
in microelectronics packaging, the research team will strive to determine how such technology could bex000D
implemented seamlessly within the unique requirements of TeraXion's modules. The research activities willx000D
first comprise the development of a Au stud bump process for SiP chips, then an evaluation of availablex000D
bonding approaches with the goal to assess their compatibility with TeraXion's requirements, followed by anx000D
optical test assessment to verify the effects of the bonding process on Teraxion's chip integrity. This will resultx000D
in a first proof of principle of Au stud bump flip chip attach for SiP assembly in order to validate the potentialx000D
to transition TeraXion's modules to flip chip technologies and evaluate the effectiveness of the bonding processx000D
and propose directions for future activity. The outcome of this project will be to provide TeraXion with anx000D
increased knowledge of flip chip-compatible bonding options and a path to more thoroughly evaluate the mostx000D
promising interconnection options for the packaging of TeraXion photonics modules.