Grants and Contributions:

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Title:

Novel packaging concepts for ultra high-speed digital communication modules

Agreement Number:

EGP

Agreement Value:

$25,000.00

Agreement Date:

Jul 12, 2017 -

Organization:

Natural Sciences and Engineering Research Council of Canada

Location:

Quebec, CA

Reference Number:

GC-2017-Q2-00121

Agreement Type:

Grant

Report Type:

Grants and Contributions

Additional Information:

Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019).

Recipient's Legal Name:

Kouki, Ammar (École de technologie supérieure)

Program:

Engage Grants for Universities

Program Purpose:

To meet the ever-growing need for more data speeds that are needed today everyday life and for most economicx000D
activities, higher speed opto-electronic communication circuits that provide larger bandwidths are required.x000D
One of the challenges of developing such circuits is how to package them in small size packages that are bothx000D
energy and cost efficient. One of the key enabling technologies in this area is the ceramic technology known asx000D
LTCC (Low Temperature Cofired Ceramics) which allows designers to build 3D packages that can meetx000D
stringent performance requirements at very high frequencies. This technology is available at our LTCC@ÉTSx000D
laboratory in École de technologie supérieure and the present projects aims to launch a collaboration betweenx000D
our Laboratory and SANMINA, a leader in the design and manufacturing of advanced optical andx000D
micro-electronic modules for various industries, whereby this technology will be used to design and validatex000D
new packaging concepts for high-speed opto-electronic modules.