Grants and Contributions:
Title:
Soft, stretchable, multi-layer printed circuit board technology
Agreement Number:
I2IPJ
Agreement Value:
$15,000.00
Agreement Date:
Mar 7, 2018 -
Organization:
Natural Sciences and Engineering Research Council of Canada
Location:
British Columbia, CA
Reference Number:
GC-2017-Q4-01143
Agreement Type:
Grant
Report Type:
Grants and Contributions
Additional Information:
Grant or Award spanning more than one fiscal year (2017-2018 to 2018-2019).
Recipient's Legal Name:
Madden, John (The University of British Columbia)
Program:
Idea to Innovation
Program Purpose:
Flexible and stretchable electronics are desired so that sensing, computation and communication can be seemlessly integrated into clothing, onto the skin or even within the body. A major challenge has been the creation of printed circuit boards that are truly compliant. Recent published work has gone well beyond polyimide flex pcb technology, but depends on relatively high cost processes. In this market assessment we propose to explore the prospects for and impact of commercialization of a technology that uses low cost materials and existing fabrication tools to create flexible and stretchable printed circuit boards.x000D